[NEWS]2023 Engineering Technology Application Symposium: Industry, Academia, and Research Converge to Present Technical Papers

The College of Engineering and the Semiconductor School collaborated to organize the "2023 3rd Engineering Technology Application Symposium" on December 1. Vice President Peng Cheng-Hsiung attended the opening ceremony, representing the university in welcoming experts, scholars, and students to exchange and share the current status of various engineering technology applications.

The symposium featured papers covering topics such as semiconductors and materials, smart manufacturing, electromechanical integration automation, artificial intelligence technology and applications, IoT technology and applications, and other engineering technology-related topics. The event began with a keynote speech by a professor from the Department of Mechanical Engineering at National Taipei University of Technology.

In his opening speech, Vice President Peng expressed that the Engineering Technology Application Symposium has reached its third edition. Through sharing research results and presenting the latest technologies, the symposium aims to become a hub for cultivating engineering and technology talents and connecting various interests, including government subsidies and corporate investments.

The "2023 3rd Engineering Technology Application Symposium" received a total of 82 paper submissions for presentation, with over 170 participants engaged in paper presentations and discussions. With the rapid development of engineering technology applications in the face of global competition, the symposium seeks to provide a platform for diverse sharing and exchanges. It aims to drive emerging fields in the midst of the ESG transformation across various sectors, creating a blue ocean effect. The symposium also anticipates being a stage for the application of new technological trends.(Provided by the Department of Mechanical Engineering)