不是理工腦也能讀 明新科大帶你「無痛轉生」科技業

▲為擴大STEM人才培育，本校將開辦專為「非理工腦」就讀的半導體及資訊工程領域的學士後專班，增加高科技業人才流入

      因應半導體發展及AI時代企業數位轉型的人力需求，本校通過教育部核定，開辦專為「非理工科」而有志從事高科技產業所設計的STEM領域學士後專班，擴大STEM領域的科技人才培育。該類學士後專班分春秋兩季招生，今年秋季班有3班，將於7月中旬公告簡章在校方網站，8月上旬開始網路報名與繳件，採書面審查，預計8月底放榜、9月初報到開學。

      杜鳳棋教務長表示，科技產業需才孔亟，為引導人才往半導體科技業發展，於112學年度開始，針對「非理工科」而有志從事高科技產業者，辦理STEM領域學士後專班。今年秋季班首度開辦「半導體封裝測試學士後專班」2班、「CIM(電腦整合製造)資訊工程師學士後專班」1班，每班招生名額皆40名，專班上課時間彈性，最快1.5年就可取得學位。除專業課程，也會包含矽格、力成科技、超豐電子、晶兆成科技、欣銓科技及欣興電子等科技大廠的業師教學及實習工作。

      「半導體封裝測試學士後專班」是採「企業契合式訂單課程」與廠商共同育才模式，業師協同授課，以實作學習方式，從基本的物理實驗、化學實驗及電子學實驗打好基礎，接續學習封裝概論與實務課程，並安排比照正式員工的實習機會。在學期間輔導考取工業局「智慧電子學院」的封裝/測試工程師能力證照，取得學位、通過證照考試，產學廠商將優先轉任更高職位或提高薪資待遇，創造「入學即就業，畢業即升遷」的學生與業界雙贏育才成果。

      「CIM資訊工程師學士後專班」為培養製造業數位轉型人才，主要就業領域鎖定在資通訊及半導體產業的電腦整合製造。為建立非理工科者的數理邏輯及資訊基礎素養，課程設計著重於資訊基礎理論的理解與實作，像是計算機概論、基礎數位實務、資訊數學、電腦網路與資料庫系統概論。程式語言學習有C、Python、Java及網頁程式設計等，進階課程則包含人工智慧、物聯網系統及微處理器系統等，建立軟硬體整合應用能力。同時輔導同學參加Python與Java國際資訊專業證照考試，建立「證書+證照、就業一把罩」的目標。

      教務處表示，STEM領域學士後專班共48學分(包括實習學分)，修業年限最快1.5年(3個學期)就可取得學士學位。上課時間彈性安排在平日夜間或周末白天上課，在職者可繼續工作，待業者可至產學合作廠商實習比照正職待遇，專為「非理工科」設計的課程，非常適合已有非理工科系大學學歷想換跑道，或待業中想朝科技產業發展的人跨領域學習。

      杜教務長舉例，去年有3位應用外語系的畢業生，利用校內半導體教學資源輔導，通過台積電面試，現在已是美國亞利桑那州廠的光罩工程師。證明非STEM領域、沒有理工腦都不是問題，只要有志從事半導體或數位科技產業，透過專業課程培訓，就能「無痛轉生」成為高科技人才。歡迎有興趣者前往招生網站查詢：https://reurl.cc/944x0d 。(資料來源/教務處)

In response to the manpower demands of the semiconductor industry and the digital transformation for AI era, our school has launched a post-bachelor program in the STEM field specifically designed for non-STEM graduates aspiring to pursue careers in the high-tech industry. This program aims to expand the cultivation of technological talents in the STEM field. The autumn semester of this year will consist of three classes, with the announcement of brochures scheduled for mid-July and online registration and document submission commencing in early August. The selection process will be conducted through a written review, and the results are expected to be released by the end of August, followed by the start of classes in early September.

Dean of Academic Affairs, Duh Feng-Chyi, emphasized the urgent need for talent in the technology industry. To guide talents toward a career in the technology industry, starting from the academic year 2023, our school is offering post-bachelor programs in the STEM field specifically for non-STEM graduates. The inaugural programs for the fall semester include two classes of "Semiconductor Packaging and Testing Post-Bachelor Program" and one class of "CIM (Computer Integrated Manufacturing) Information Engineer Post-Bachelor Program." Each class will accommodate 40 students, offering flexible class schedules. Students can obtain their degrees in as little as 1.5 years. These programs will not only provide specialized courses but also include teachings from industry experts and internship opportunities at major technology companies.

The Office of Academic Affairs explained that the STEM post-bachelor program consists of 48 credits, including internship credits, and can be completed in a minimum of 1.5 years (3 semesters) to obtain a bachelor's degree. Classes are scheduled during weekday evenings or weekend daytime, allowing working professionals to continue their employment, while providing internship opportunities with benefits comparable to regular positions for unemployed individuals. The curriculum is specifically designed for non-STEM graduates, and is highly suitable for individuals with non-STEM backgrounds who are seeking to switch careers or unemployed individuals aiming to enter the technology industry. By enrolling these professional courses, individuals with aspirations in the semiconductor or digital technology industry can seamlessly transform into high-tech professionals. Interested individuals are encouraged to visit the enrollment website for more information: https://reurl.cc/944x0d. (Source: Office of Academic Affairs)

▲因應科技產業人力需求，本校開辦專為「非理工腦」設計的半導體及資訊工程的STEM領域學士後專班，協助人才無痛轉入科技業